|
Welcome to the newsletters section. If
you want to stay informed about the news and developments in
the technology and business of microelectronic components and semiconductors
then you can contact
us for a free sample copy of one or all of our unique email
newsletters:
This
website is home to the subscription-only
publication
Robust Electronics
Review
In due
course we intend to include an online directory of
ruggedised/ruggedized components to assist
designers.
I know
it is a moot point but a lot of thought went into the
newsletter's name. We like the term robust but it could also
be called 'Ruggedised Electronics Newsletter' or
'Ruggedized
Electronics Newsletter' depending on which side of the
Atlantic you are.
Alternative names
for consideration included:
- 'High
Temperature Electronics Newsletter' or
- 'Extreme
Temperature Electronics Newsletter'
To be
subject specific it could be called:
- Automotive
Electronics News or Newsletter
- Defence
Electronics News or Defense Electronics Newsletter
- Downhole
Electronics News or Down-Hole Newsletter
- Nuclear
Electronics News or Newsletter
But we
felt that these titles did not quite cover the full extent of
the modern electronics industry segment which requires more
durable components. The coverage includes - but is not limited
to - the following topics:
- High
temperature electronics news >100C Mil Std etc.
- Low
temperature electronics news, i.e. cryogenic etc.
- Radiation hard,
radiation-hard,
'rad hard' (rad-hard) or radiation hardened electronics news
for space and nuclear applications, etc.
- High
vibration or anti-vibration high durability electronics
systems news, etc.
- Shock-resistant
or anti-shock 'high g' durable components, etc.
- Adverse
environment electronics, e.g. for automotive
electronics
- Chemical-resistant
materials, components and assemblies
- Moisture-resistant
materials, components and assemblies
- Electromagnetic
pulse (EMP) resistant materials, components and assemblies
including EMC and ESD
- Vandal-proof
equipment
- Ruggedized
computer and telecom equipment
- Defense
hardware such as electronic warfare systems, fuzes,
etc.
- Flame- or
fire-proof assemblies
- Temperature,
radiation and other monitors and sensors
- Design software
and modelling
We
believe that there is an outstanding need for concise, regular
information on this family of topics. The newsletter thus
saves you time searching through all of the many online and
print publications in electronics.
The family of newsletters has been in
publication for over three years. They have a special format
in that they arrive on your desktop every other week as an
Acrobat file. The news items have a hyperlink to take you
directly to the company in question.
Each newsletter covers a fairly narrow
range of technical and business aspects of the chosen subject.
Also included is a regular update on issued and applied-for
patents.
Designed to save you the effort and time
of surveying all the diverse news sources on the web, these
email newsletters bring the news to you. Print them out or
view on screen, they are fully illustrated, concise and
informative.
A special offer invitation is extended to
new readers to show you how the email newsletters work. So
apply now for a 3-issue free trial at absolutely no
obligation. Simply email us and we will send you the next
three consecutive issues free and only then will we ask you to
take up an annual subscription.
Roy's GaN Stuff on the Web
In this section we draw your attention to
some of our GaN-related work which can be found on the
WWW.
1. Market report: Blue diodes
infiltrate the domestic market
Abstract: The future is bright for the
latest light-emitting diodes on the market. Blue and white
versions have come a long way in the last two years. Roy
Szweda looks at the latest developments taking place in Europe
and around the world.
From Opto & Laser Europe March
2001
2. Recovery in
diode-laser market expected by 2003
The diode-laser markets for optical
data-storage and industrial applications are expected to see
rapid growth in the next five years. A recent report suggests
that telecoms applications will recover by the end of this
year. Rebecca Pool reports. This is something I helped out
with for Opto & Laser Europe April 2002, so it is not
original. RP is now with CSM so check out some of her fine
pieces on their website.
3. Market report:
VCSELs edge out the edge emitters
From Opto & Laser Europe July/August
2001
In less than five years VCSELs have
become the darling of telecoms networkers. If promising
R&D can be translated into products, VCSELs could push out
the edge emitter from datacoms and become the key component in
displays, says Roy Szweda.
The following half-dozen are from III-Vs
Review and as yet there are no direct links. If you are really
interested then I could probably rustle something up by email.
I can't put the pdfs up here because of copyright.
4. SiC micro markets
develop
SiC is a material which has rapidly
matured in a decade. From obscurity and difficulty it has
become an important practical commercial proposition for a
growing number of companies. Today it stands astride two
markets with companies offering both opto- and
micro-electronic devices based on it.
5. Cover feature: Successors to
sapphire in the GaN market
2002 has seen a
resurgence of interest in the development of GaN single
crystal substrates. Roy Szweda reports on developments and
assesses the future commercial viability of pure GaN
wafers.
6. Phosphide and Nitride Devices
in 2002
InP and GaN: these two materials are a
modern day success story but so far only in optoelectronics.
Their potential for use in microelectronic devices has yet to
migrate successfully from the laboratory into commercial
production.
7. Trends in markets for GaN
devices
Roy Szweda summarises some of the recent
technical and marketing developments in the market for gallium
nitride devices.
8. Crystal Gazing: LEDs to
enhance safety at Grand Prix motor race
9. Crystal Gazing. Dreaming of a
blue (LED) Christmas
10. Gallium
Nitride & Related Wide Bandgap Materials &
Devices
A Market & Technology Overview
1998-2003
Second Edition, Originator & Author: Roy
Szweda. No direct link to the info so I may put something up
here later on. You have to look for it on the III-Vs Review WS
under Related Products - check out our other reports in the
series, e.g. SiGe.
This report was published a year ago and
a new one is due next year. See here as
well. Or here if
you want details of the first edition.
11. OEMagazine January 2001, Volume 2,
Number 1
Optoelectronics - improved
SiC growth method provides basis for blue lasers
A new
method for growing bulk single-crystal silicon carbide (SiC)
can produce high-quality SiC wafers for optoelectronics
applications, say engineers at Okmetic AB (Linköping, Sweden),
a member of the Okmetic group (Vantaa, Finland). "We have been
building on our long-term work with Linköping University,"
says Asko Vehanen of Okmetic. "This has borne fruit in the
form of a radically new method for SiC crystal growth,
high-temperature chemical vapor deposition
(HTCVD)."
12. OEMagazine December 2000, Volume 1,
Number 12
Integrated Optics - Laying
it on Thick
With the metropolitan-area-network
(MAN) market widely hailed as the next big growth area for
optical communications, cost reduction has become a paramount
issue for components manufacturers. One avenue for
accomplishing this task is chip-level integration of passives,
or of actives with passives. From a manufacturing point of
view, coating an entire silicon wafer with silica can be
challenging, with techniques like flame hydrolysis deposition
and chemical vapor deposition (CVD) requiring high
temperatures and extended times for deposition. At the
European Conference on Optical Communications (ECOC;
Amsterdam, The Netherlands; 1–5 October), Heriot-Watt
University (Edinburgh, UK) spinout Terahertz Photonics (TP;
Livingston, Scotland, UK) offered a fast, low-temperature
alternative—a sol-gel method for silica-on-silicon circuits.
13. OEMagazine December 2000, Volume 1,
Number 11
Optoelectronics - GaAs-on-silicon
process opens way to OEICs
For years, optoelectronics
manufacturers have focused on ways to replace expensive GaAs
substrate materials with silicon wafers, which are economical,
easy to manufacture, and available in diameters as large as
300 mm. Now, a unique alliance between Motorola Inc.
(Schaumburg, IL) and IQE Plc (Cardiff, UK) has culminated in
the world's first demonstration 8-in. and 12-in. GaAs-on-Si
wafers. In essence, the new technology is the first to
successfully combine the best properties of workhorse silicon
technology with the speed and optical capabilities of
high-performance compound semiconductors.
14. OEMagazine December 2000, Volume 1,
Number 10
Blue diode lasers - European
firms exploit GaN diode lasers
The advent of the
gallium-nitride (GaN)–based violet diode laser (VDL) attracted
a lot of interest, particularly for its commercial
implications in the optical data-storage market. Consumer
products integrating VDLs should reach market in two to three
years. That is not where the VDL market is today, however.
Perhaps surprisingly, two of the companies driving the
commercialization of the VDL are into the instrumentation
market. What is more, they are not in Japan; they are in
Europe.
15. OPTOELECTRONICS REPORT
Optoelectronics – A
Strategic Study of the Worldwide Semiconductor Optoelectronic
Components Industry to 2005 Second Edition
Weakening demand, in particular from the
communications sector, excess inventories and the impact of
the downturn in the US on the global economy will result in
the optoelectronic component market falling sharply in 2001.
The decline however, is not expected to be as steep as the
semiconductor market as a whole, falling by just over 14% to
US$7.6 billion. See
here.
This report was published a year ago and
a new one is due next year.
16. Diode Laser
Materials & Devices - A Worldwide Market & Technology
Overview to 2005
This market research report examines the
developments of the diode laser industry over a six-year
period, 2000 to 2005, incorporating analysis of trends in
markets, technologies and industry structure. Designed to
provide key information to users and manufacturers of
substrates, epitaxial wafers and devices. Coverage includes
components, laser diodes, and the semiconducting wafers and
epiwafers on which most of these devices are made: materials
and devices based on gallium arsenide, silicon carbide, indium
phosphide, gallium nitride, indium antimonide, etc.
17. Silicon
Germanium Materials & Devices - A Market & Technology
Overview to 2006
A brand new report originated and
authored by us is 'an indispensable business reference' and
examines the development of the silicon germanium business
over a six-year period. It analyses the trends in markets,
technologies and industry structure and profiles all the major
players. Specifically aimed at users and manufacturers of
substrates, epiwafers, equipment and devices, it provides an
analysis of the technical and business of SiGe. Herein you
will find a competitive assessment of the market of SiGe vs.
gallium arsenide, indium phosphide vs. other forms of silicon,
etc.
ISBN: 1 85617 396 8
18. Wireless Applications
Not really GaN but it is available to
read on the net is my article for Wireless Europe entitled Chip
makers strive to cut 3G energy consumption.
I quite
liked doing this article because there are very few attempts
to get under the skin of this popular subject in this way.
Maybe it is because the engineers et al., don't want to reveal
their tricks or maybe because it is it is such a fast-moving
activity that it ages quickly. I could have a new go at it and
try to see how SiC or GaN might fit in...
For secretarial services why not try RNR
Associates? Click here
to find out more. | 